PCB printed circuit board processing as a special area in the printed circuit board industry, the people, for the PCB copy board in a PCB design process, professional body to PCB copy through our panel of people in the financial statements in connection We are have made a professional PCB copy board of experts the Board following lines to specific PCB processing, printed circuit board industry in the hope of help.

additive process also made reference to resist to the substrate surface using other non-conductor copper wire local loop chemical layer, the growth process directly (see Journal Board Information, No. 47, p.62). more PCB copy board method can be used in full, half of the addition and part of the addition of other types are divided.

baskets, plates, maps mothers is thicker (eg, 0.093 “, 0.125″) of the PCB, especially for contact with the other board. The approach is a multi-pin () is a tight hole, but do not weld, but on the whole line to the pins on each wire, then one by one cable winding means. Connector on the motherboard can be copied to the Council. Because of this Council, in particular, the hole can not be welded, but the cell wall and lead to the needle clamp be directly used where the requirements of the quality and accessibility are particularly strong, their orders are not a lot Circuit are generally not ready, not just those jobs , suppose the U.S. almost a high-quality and specialized. additional layer of legal proceedings

BuildUpProcess This is a new area of thin multi-layered approach is the first process of enlightenment SLC IBM, began the work Yasu Japan with the production study in 1989, the law for both traditional base of the plate, since the two first-round cladding outer surface of the liquid photosensitive precursors such Probmer52 by the semi-rugged and sensitive Xiang Jie, provide a flat because of the following form of low-level “hole camera (photo -Via), other chemical deposition of copper with an overall increase of the layer of copper conductor, but also by the imaging line and the etching get new son and the interconnection with holes or buried underlying blind holes. Repeat this extra layer get the number the layers of multilayer printed circuit boards. This method can not only costly mechanical drilling and its pore size can be less. to 10 thousand in the last 5-6 years, all of which has by breaking the tradition with successive layers of the multilayer technology industry in the United States and Japan continues to change in the push, making them BuildUpProcess fame, has more than ten kinds of products on the market Zheyi more. In addition to the above “photographic hole” outside, then after the removal of the holes for chemical copper base plate hole organic biting, burning hole laser (laser ablation) and plasma etching holes (PlasmaEtching) so different that a “hole” approach, however. They can also of resin-coating of the semi-hardened “rubber sheet” be new (ResinCoatedCopperFoil) using the method of successive layers (SequentialLamination), more intensive in a small and thin films. A variety of Future Electronics products, the light of the real world be short layers.

cermet cermet ceramic powder and metal powder mixture then add as a kind of joint Paint can the board (or the upper inner) layer is thick or thin pressure, a “resistance” of the canvas has been placed to replace the entire external resistor.

co-fire

A ceramic hybrid circuit PCB (Hybrid) of a process, the surface of platelets with all manner of precious metal thick film paste printed (ThickFilmPaste) online, placed on the market were in the cooking temperature. To burn the thick paste in a variety of organic materials, so that precious metal wire interconnection lines as a driver.
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